ACCELERATING CAPABILITIES AND POSSIBILITIES

Tower Workstation AGW-1310

KEY FEATURES

SPECIFICATION

PRODUCT IMAGES

INNO3D Tower Workstation

Full Tower Workstation Series

INNO3D Tower Workstations harness the parallel processing capacity of GPUs to empower businesses to enhance their capabilities in High-Performance Computing (HPC), data analysis, genomics, 3D modelling and imaging, machine learning, simulations, deep learning, AI, and other essential requirements. This cost-effective system excels in AI inference, 3D rendering, model simulation, and more, offering competitive price-to-performance benefits.

Workstation Tower with Motherboard Bundle

INNO3D TOWER WORKSTATION FEATURE HIGHLIGHTS

SKU: AGW-1310

3rd Gen. Intel® Xeon® Scalable Processors
Intel® Xeon® W-3300 Processor Family
8-Channel RDIMM/LRDIMM/RDIMM-3DS DDR4 Memory, 8 x DIMMs
Optimized Air Cooling / Water Cooling ready Tower Chassis
Dual 10Gb/s LAN support (RJ45)
Dual 1Gb/s LAN support (RJ45)
7 x PCIe Gen4 expansion slots
Up to 3 dual-slot GPU support

UP TO 10 GPU READY

Offering high-performance computing capabilities for a wide range of demanding applications.
*GPU sold separately. Up to 10 GPU dual-slot GPUs ready

MODULAR DESIGN

Installing or upgrading components and maintaining server products are more easily accomplished with a streamlined modular design for easier access to internal hardware.
*Available on select models

HIGH SPACE TO PERFORMANCE RATIO

A smartly designed chassis provides more space when compared to those of similar size and form factor, providing up to 10 full-length full-height, dual-slot graphics cards to offer a greater space to performance advantage.
*select models

PCIe DIRECT DRIVE

Enabling flexible Server use scenarios on a wide scale:
Storage Focus
Prioritize PCIe connections to storage
Compute Focus
Prioritize more PCIe bandwidth for maximum GPU capabilities
Multi-server Focus
Enable more PCIe bandwidth towards high-speed network connectivity between Servers for even more computational performance

POWERFUL COOLING

Equipped to cool with powerful air coolers or high-performance liquid-cooled hardware, the streamlined design of INNO3D GPU Servers maximizes efficient heat dissipation to provide greater cooling to the entire machine, especially critical components like the CPU and GPU to enable higher and longer sustained performance.
*The number and performance equipped fans may vary by model

REDUNDANT POWER

With support with up to 4+1 2000W 80 PLUS Titanium redundant power supplies, INNO3D GPU Servers can further maximize efficiency to provide uninterrupted operation, reduce operating costs, and enable easier servicing.

DUAL ROM
ARCHITECTURE

If the ROM that stores the BMC and BIOS fails on INNO3D GPU Servers, the system will automatically reboot with the backup for uninterrupted operation. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization.
*Available on select models

TRUSTED PLATFORM
MODULE 2.0 READY

INNO3D GPU Servers include a TPM header to support an optional TPM 2.0 module for hardware-based authentication and sensitive data storage.
*Available on select models

FROM HIGH-PERFORMANCE
COMPUTING WORKSTATIONS
TO ENTERPRISE SERVER

Handle standard small & medium workloads with the right-sized performance in a Server grade Tower Workstation or take on business-critical demands with scalable rack-mounted GPU 4U Servers.

LP_2024_INNO3D_GPU_server_side_banner_02.jpg Alternative text

Nvidia-omniverse-logo

3D design collaboration and simulation and more, NVIDIA Omniverse™ is a computing platform that enables individuals and teams to develop Universal Scene Description (OpenUSD)-based 3D workflows and applications. From concept design for animated movies, to industrial digital twins of factories, Omniverse transforms the way teams approach building and operating metaverse applications.

CREATE IN 3D FASTER
THAN EVER

Sync your favorite creative apps to Omniverse and USD and work with your 3D data in a unified view.

AUGMENTED BY AI

Build custom extensions, tools, and microservices to
accelerate your 3D workflows, generate synthetic data,
and build industrial metaverse applications.

POWER INDUSTRIAL
DIGITALIZATION

Break 3D data silos, unify large enterprise teams, and
enable the next wave of 3D and simulation workflows.

INTEL® XEON® SCALABLE PROCESSORS

Designed to accelerate performance across fast-growing workloads, Intel Xeon Scalable Processors have powerful built-in accelerators to help improve performance efficiency for emerging workloads like AI and deep learning applications. These built-in accelerators can also ensure maximum efficiency in the core and power utilization, optimizing operational sustainability.

intel-logo

Intel® Advanced Matrix Extensions
(Intel® AMX)

To boost AI inference and training with 2D tiled operation

Intel® QuickAssist Technology

For faster encryption and bulk data compression

Intel® In-Memory Analytics Accelerator
(Intel® IAA)

To boost database performance with lower memory bandwidth

Intel® Data Streaming Accelerator
(Intel® DSA)

To speed-up data movement

Intel® Dynamic Load Balancer
(Intel® DLB)

To optimize queue scheduling and packet processing

AMD EPYC™ PROCESSORS POWERING THE NEXT GENERATION OF SERVER ARCHITECTURE AND ENERGY EFFICIENCY

The new family of EPYC processors deliver even better CPU performance and performance per watt and do so on a platform with 2x the throughput of PCIe 4.0 lanes that also has support for 50% more memory channels. For this new platform, ZOTAC 4th Gen AMD EPYC supported Servers can get the most out of EPYC-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.

4th Gen AMD EPYC Processors for SP5 Socket

5nm architecture

Compute density increased with more transistors packed in less space

128 CPU cores

Dedicated cores and targeted workloads for Zen 4c & Zen 4 cores

Large L3 cache

Select CPUs have 3x or more L3 cache for technical computing

SP5 compatibility

All 9004 series processors are supported on one platform

DDR5 memory

Increased memory throughput and higher DDR5 capacity per DIMM

PCIe 5.0 lanes

Increased IO throughput achieving 128GB/s bandwidth in PCIe x16 lanes

inno3d_logo

DISCLAIMER

The information presented in this page is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors. The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and specification changes, component and motherboard version changes, new model and/or product releases, product difference between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or this like. InnoVISION assumes no obligation to update or otherwise correct or revise this information. However, InnoVISION reserves the rights to revise this information and to make changes from time to time to the content hereof without obligation of InnoVISION to notify any person of such revision or changes.
InnoVISION makes no representations or warranties with respect to the contents hereof and assumes no responsibility for any inaccuracies, errors or omissions that may appear in this information.

Copyright Notice

© Copyright 2024, InnoVISION Multimedia Limited. All rights reserved. The INNO3D®, INNO3D Brutal by Nature Logo, are the registered and/or trademarks of InnoVISION Multimedia Limited in Asia, Europe and / or other countries. NVIDIA®, NVIDIA logo are registered and/or trademarks of NVIDIA Corporation in the United States and other countries. All other trademarks and registered trademarks are the property of their respective owners.

Datasheet:

Datasheet

PDF

Download Data Sheet

Computing System

Reference Number

Bundle package: AGW-1310
Chassis: AWC-T690U1
Motherboard: AWB-A21U8

Form Factor

Full Tower

Motherboard

ATX
304.8mm x 244mm / 12in x 9.6in (L x W)

CPU

3rd Generation Intel® Xeon® Scalable Processors
Intel Xeon® Platinum / Gold / Silver Processor support
Intel Xeon® W-3300 Processor support
up to 300 W TDP

Socket

1 x LGA 4189 (Socket P+)

Chipset

Intel C621A

Memory

DDR4, 8 x RDIMM / LRDIMM / RDIMM-3DS, DIMM slots
RDIMM / LRDIMM modules (up to 128GB)
RDIMM-3DS modules (up to 256GB)
1.2V modules (3200/2933/2666 MT/s)

Graphics:

Graphics

Video

Integrated Aspeed® AST2600
1920x1200@60Hz, DDR4 SDRAM

Storage:

Storage

1 x MiniSAS connectors for 4 x SATA-3 6Gb/s ports (optional MiniSAS cable)
2 x 7-pin SATA DOM 6Gb/s ports
1 x M.2 NVMe PCIe Gen3 x4 or SATA 6Gb/s SSD slot (2242/2280/22110, M-key)
1 x M.2 NVMe PCIe Gen3 x1 or SATA 6Gb/s SSD slot (2242/2280/22110, M-key)

RAID

Intel® SATA RAID 0/1/10/5

I/O Ports:

I/O Ports

LAN

2 x 10Gbps Intel LAN ports (X710-AT2)
2 x 1Gbps Intel LAN ports (I210)
1 x Gigabit management port (BMC)

Expansion Slots

7 x PCIe Gen4 slots
Max: 4 x PCIe Gen4 x16 slots + 3 x PCIe Gen4 x8 slots or
1 x PCIe Gen4 x16 Slot + 6 x PCIe Gen4 x8 Slots

Front I/O

2 x USB 3.0, System Reset Switch

Rear I/O

4 x USB 3.2 Gen1
1 x VGA
2 x 10Gbps RJ45
2 x 1Gbps RJ45
1 x MLAN
1 x ID button with LED

Backplane I/O

N/A

Mechanical:

Mechanical

Power Supply

2 x ATX PSU bays (PSU not included)

Cooling

Front: up to 4 x 120/140mm fans, or 360mm Water cooling radiator
Top: up to 4 x 120/140mm, or 480mm Water cooling radiator
Right: up to 3 x 120mm, or 360mm Water cooling radiator
Direct Liquid Cooling ready

No Cooling fan or Water Cooling radiator is pre-installed

Operation Properties

Operating temperature: 10°C to 40°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Product Dimensions

L x W x H
591mm x 249mm x 691mm / 23.27in x 9.8in x 27.2in (w/ wheels)
591mm x 249mm x 630mm / 23.27in x 9.8in x 24.8in (w/o wheels)

Product Weight

N/A

Miscellaneous:

Miscellaneous

OS Compatibility

Windows Server 2019 / 2016 (x64)
Red Hat Enterprise Linux 8.3 / 7.9 (x64)
CentOS 8.3 / 7.9 (x64)
SUSE Linux Enterprise Server 15SP2 / 12 SP5 (x64)
Ubuntu 20.10 / 20.04.1 (x64)
VMware ESXi/vSphere 7.0 Update1c / 6.7 Update3
Hyper-V Windows® Server 2016 / 2019

TPM

1 x TPM header with SPI interface
Optional TPM 2.0 Module

Contents

1 x Full Tower Workstaton chassis
1 x Motherboard
1 x I/O shield
1 x Mini SAS HD to 4 x SATA Cable
1 x SATA3 Cable
2 x Screws for M.2 Sockets
1 x CPU Non-Fabric Carriers

Available SKU:

Available SKU

N/A

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