INNO3D GEFORCE RTX™ 3080 ICHILL X4 LHR
AMP UP YOUR GAMING WITH INNO3D® GEFORCE
RTX™ 3080 / 3090 X4
INNO3D® introduces its new INNO3D® GeForce RTX™ 30 Series with an exciting range of cutting-edge fans including the iCHILL X4 with programmable RGB that boasts large triple 9cm fan with a side rotor fan to cool the MOSFET. Specifically designed to be an ultimate cooling solution and with factory overclock so that all you have to do is plug and play your favourite games straight from the box.
GEFORCE RTX™ 30 SERIES
THE ULTIMATE PLAY
The new NVIDIA GeForce RTX™ 30 Series GPUs, the 2nd generation of RTX™, features new RT Cores, Tensor Cores and streaming multiprocessors, bringing stunning visuals, amazingly fast frame rates, and AI acceleration to games and creative applications. Powered by the NVIDIA Ampere architecture, which delivers increases of up to 1.9X performance-per-watt over the previous generation, the RTX™ 30 Series effortlessly powers graphics experiences at all resolutions, even up to 8K at the top end. The GeForce RTX™ 3090, 3080 and 3070 represent the greatest GPU generational leap in the history of NVIDIA.
NVIDIA AMPERE ARCHITECTURE
2ND GENERATION
RT CORES
2X THROUGHPUT
3RD GENERATION
TENSOR CORES
UP TO 2X THROUGHPUT
NEW
SM
2X FP32 THROUGHPUT
DLSS AI ACCELERATION
MAX FPS. MAX QUALITY. POWERED BY AI.
NVIDIA DLSS is groundbreaking AI rendering that boosts frame rates with uncompromised image quality using the dedicated AI processing Tensor Cores on GeForce RTX™. This gives you the performance headroom to crank up settings and resolutions for an incredible visual experience. The AI revolution has arrived to gaming.
*Footage captured on RTX™ 2060 at 3840x2160 max settings.
ADDITIONAL FEATURES AND BENEFITS
NEW COOLING SOLUTION WITH ROTOR FAN
Triple fan with 9cm Scythe blades to maximise airflow and optimised to operate in low fan speed condition. The X4 boasts a very unique 4.5cm side rotor fan to cool the MOSFET area adding additional cooling power to the X4.
ULTRA-THIN COOLING FINS
Ultra-smooth DHT surface for GPU composing of 8 heat pipes with CNC process. Copper base for effective MOSFET and memory heat transfer.
BACK PLATE DESIGN
Solid die casting back plate with studded surface to increase the surface area for memory and component cooling.
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